A
system in package (
SiP) or
system-in-a-package is a number of
integrated circuits enclosed in a single module (
package). The SiP performs all or most of the functions of an
electronic system, and is typically used inside a
mobile phone,
digital music player, etc.
Dies containing integrated circuits may be stacked vertically on a
substrate. They are internally connected by fine
wires that are bonded to the package. Alternatively, with a
flip chip technology, solder bumps are used to join stacked chips together.