Wafer dicing is the process by which
die are separated from a
wafer of
semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical
sawing (normally with a machine called a
dicing saw) or by
laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual
silicon chips are encapsulated into
chip carriers which are then suitable for use in building
electronic devices such as
computers, etc.